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APEL Postforming Glue


APEL Postforming Glue is a water based PVAc. glue that is used to bond laminate papers to MDF or chipboards. It is also used for postforming applications and very suitable for high temperature applications. It is highly resistant to different sources of temperature and will not debond even in risky applications. It does corrose, get moldy or char and highly resistant to physical effects.

  • The glue will not debond under high temperatures in application.
  • No colorization, charring or fading in application.
  • Strong physical resistance against impacts after cured.
  • Semi-transparent color.
  • Glue is used to bond HPL and CPL laminaton papers under high heat to MDF, chipboard and solid wood.
  • Suitable for roller press applications.
  • Suitable for cold press lamination. (Check press time)

 

  • Furniture Industry

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